Asia Tech News Digest - July 29, 2026

1
Semiconductor
2
Electronics
1
Logistics
0
Pharmaceutical
0
Biotechnology
6
AI
1
Automation
0
Machine Vision
# Source Title Summary Topics Link
1 TechAsia This startup fixes the quality problem in remote hiring FindTalent.ph connects small businesses with pre-screened Filipino professionals using AI matching and manual recruiter verification. AI
2 DigiTimes China's GenAI race shifts to open source ecosystems The global GenAI race has remained intense, with major US players including Google, Meta, Microsoft, Amazon, and OpenAI investing heavily. But with Beijing-based startup Moonshot AI launching Kimi K3, a new large language model (LLM) with multimodal and long-context reasoning capabilities, along with the rapid rise of AI
3 DigiTimes White House reportedly approaches final framework for reviewing frontier models The US government is said to be close to creating a final version of a voluntary framework for evaluating AI companies' advanced models before they are released to the public. A finalized framework could clear up weeks of uncertainty, but for now many questions about it remain, such as the exact review process, what co AI
4 TechAsia DBS rolls out AI banking tools to 10 million users In Singapore, DBS Joy now offers agentic features to 350,000 corporate users. Another 100,000 users in Hong Kong are due to get the features in September. AI
5 DigiTimes Intel Foundry completes US microelectronics prototype program Intel Foundry has completed a US defense-backed semiconductor prototype program that could have implications for supply chain resilience, national security, and global access to advanced chips. The work, tied to Intel 18A technology, aims to expand trusted domestic manufacturing and could shape how allied governments a SemiconductorElectronicsLogistics
6 TechAsia OCBC rolling out AI to cut private banking onboarding time OCBC said HELIOS completes much of know-your-customer due diligence before relationship managers engage prospective clients. AI
7 EETAsia Beyond Silicon: GaN and the Future of Heat-Resilient Power Electronics in Singapore As power densities rise, GaN technologies are reshaping thermal management and enabling more efficient, reliable power electronics systems. The post Beyond Silicon: GaN and the Future of Heat-Resilient Power Electronics in Singapore appeared first on EE Times Asia . Electronics
8 NikkeiAsia Iran war and AI demand help drive revenue at Rio Tinto, Woodside Iran war and AI demand help drive revenue at Rio Tinto, Woodside AI
9 NikkeiAsia Japan's Genki Robotics to launch first product this year, says CEO Japan's Genki Robotics to launch first product this year, says CEO Automation

Generated: 2026-07-29 08:00 UTC · Sources: 4 websites monitored