Asia Tech News Digest - July 23, 2026

3
Semiconductor
1
Electronics
0
Logistics
1
Pharmaceutical
0
Biotechnology
7
AI
3
Automation
0
Machine Vision
# Source Title Summary Topics Link
1 TechAsia Samsung Electro-Mechanics signs $204m AI server deal According to Samsung Electro-Mechanics, a single AI server rack can use up to 600,000 MLCCs, more than 10x the number used in a conventional server rack. AI
2 TechAsia The platform turning AI search into a measurable ROI Inflect helps B2B and consumer brands measure their share of voice across tools like ChatGPT, Perplexity, and Gemini. AI
3 DigiTimes Samsung weighs Besi's Korean rivals for 50-bonder hybrid bonding line as pricing talks drag on Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation high-bandwidth memory and logic chips, according to The Elec . ElectronicsSemiconductor
4 DigiTimes Mitsubishi Electric and Sony Semiconductor Solutions form AI factory automation venture Mitsubishi Electric and Sony Group subsidiary Sony Semiconductor Solutions announced on July 22, 2026, that they have signed a partnership agreement to launch a joint venture focused on using image sensors to automate manufacturing sites and develop physical AI technology. The new company will be 60% funded by Mitsubis SemiconductorAIAutomation
5 DigiTimes Intel 18A adopts High-NA EUV in dual-certification push Intel Foundry has moved high numerical aperture (High-NA) EUV lithography into production on its Intel 18A process, with ASML confirming in a recent press release that Intel is using the expensive next-generation tool on selected layers of its latest notebook processors, including Panther Lake and the Core Ultra Series Semiconductor
6 TechAsia This founder built AI hardware investors ignored Samantha Johnson, founder and CEO of Tatum Robotics, says investors dismissed her market as too small until DeafBlind users proved otherwise. AIAutomation
7 CNA Besi orders more than double as AI and hybrid bonding tech drive demand Besi orders more than double as AI and hybrid bonding tech drive demand AI
8 CNA Dassault Systèmes confirms 2026 outlook, bets on AI with $1.8 billion ArisGlobal deal Dassault Systèmes confirms 2026 outlook, bets on AI with $1.8 billion ArisGlobal deal AI
9 NikkeiAsia Global corporate bond sales hit $3.7tn in first half on AI funding race Global corporate bond sales hit $3.7tn in first half on AI funding race AI
10 NikkeiAsia Trump's generic drugs tariff threatens Indian pharma's top market Trump's generic drugs tariff threatens Indian pharma's top market Pharmaceutical
11 NikkeiAsia Taiwan to push advanced robotics on distinct path from China: tech czar Taiwan to push advanced robotics on distinct path from China: tech czar Automation

Generated: 2026-07-23 08:00 UTC · Sources: 4 websites monitored